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Eutectic Die Bonding
MCM Assembly
Microwave Module
Flip Chip
Optical Modules
High Accuracy Placement ±10 µm
360º Random Die Orientation
Substrate Alignment (global & local)
Programmable Controlled Force
Delicate Part Handling Including GaAs Devices
Windows™ Driven Software
Automatic Tip Changing or Optional Turret
Cassette to Cassette Handling
Waffle Packs, Gel Packs, Tape Feeder, Wafer Pick Up
VIDEOS
 Eutectic
Needle Clean
Sector Plate
Tip Changing
Local & Global Die Alignment
Wafer
Small Die Handling
GaAs Delicate Handling
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 Multichip
Assembly MRSI-605 AP Assembly Work Cell MRSI-M5 Underfill
Dispenser MRSI-175UF Integrated
Production Lines Encapsulation
Dispensing MRSI-175 ENCore Conductive
Epoxy Dispensing MRSI-175Ag Probe
Line
MRSI-605 AP Ultra Precision Assembly Work Cell
The MRSI-605 AP Ultra-Precise Assembly Work Cell is regarded
as the industry standard for ultra-precision assembly and is proven in critical microelectronic applications worldwide. Vision-guided and fully automatic, the MRSI-605 AP provides both ultra precision and high speed. .
1997 Vision Award Winner
Excellence in Electronics Packaging & Production Award Winner
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ADVANTAGES:
In-Line Capability
SMEMA compatible for easy, seamless integration.
High Speed
Overhead solid granite platform provides mechanical and thermal stability. Linear
glass scales provide position feedback for the high-speed DC servo motors. Extremely
fast and requires very little setting time.
Ultra Precision
The MRSI-605 AP is the proven leader worldwide for ultra-precision placement
accuracy.
Ease of Programming
Windows™ interface and XML database for ease of programming. CAD downloading and uploading of
management information capability. Program load time significantly faster than
competitive systems.
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360º Die Orientation
Unique capability to locate randomly orient die over a full 360º range at high speeds.
Eutectic Experience
Handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium.
Flip Chip Capability
Integrated vision utilizing an upward-facing camera, application-specific lighting and optics.
Delicate Handling
Controlled contact force for delicate handling of GaAs devices.
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SPECIFICATIONS:
General
- High speed X, Y, Z, Theta Positioner
- Large Work Area — 680 Sq. In.
- Overhead Solid Granite Platform
- Automatic Material Handling
- Stand-Alone or In-Line
- CE, SMEMA
Mechanical
- X-Y Resolution 0.5 micron
- Linear Glass Scales
- Theta Resolution: 0.0072 degree (standard)
- Accuracy: +/- 10 µm
- Repeatability +/- 0.0001
- Speed XY: 35 ips
Dispensing
- Positive Displacement Pump
- Time Pressure Dispense
- Laser Height Sensor
- Auto Tip Cleaning / Needle Calibration
- Epoxy Stamping for dots down to 0.005
Vision System
- Optical Alignment
- Global/Local Alignment
- Die Features Alignment
- Fiducials/Pattern Recognition: User Defined
- 360 degree Random Die Orientation
- Lighting Oblique/Through Lens/Ring or Collimated
Facilities
- Power: 208 VAC, 60 Hz, 20 Amps
- Vacuum: 20" of Hg
- Pneumatics: 80 PSI, 1 cfm
- Dimensions: 47" (L) x 52" (W) x 77" (H)
- Weight: 4650 lbs (2110 kg); crated: 5000 lbs (2270 kg)
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Pick and Place
- Programmable Force
- 6 Tool Turret Option
- Auto Tip Changing
- Waffle Pack/Gel Pack
- Tape & Reel
- Multiple Wafer Feeding
- Feeders
Special Handling Components
- Beam Lead Diodes
- GaAs Die
- Silicon Die
- Substrates
- Duroids
- Eutectic Preforms
Material Handling Packages
- Auto Magazine Load & Unload
- Boat Conveyor or Lead Frame Indexer
- Mechanical/Vacuum Fixturing
- Heated Work Stage
- Common Carriers
Packages
- Optical Modules
- Microwave Modules
- RF Modules
- Multichip Modules
- Hybrid Circuits
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