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High Accuracy Eutectic BondingLaser Diodes to Submounts
Photodetectors to SubmountsVCSEL AssemblySubmount to Laser BenchFlip ChipDie Bonding
Eutectic Heat Stage
Flip Chip Bonding
Waffle Pack, Gel-Pak, or Wafer
Windows™ Software
XML Database
In-line or Stand-alone
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 Few
Chip Assembly MRSI-375 Multichip
Assembly MRSI-605 Optical
Assembly MRSI-5005 OPTO Underfill
Dispenser MRSI-175UF Integrated
Production Lines Encapsulation
Dispensing MRSI-175 ENCore Conductive
Epoxy Dispensing MRSI-175Ag Probe
Line
MRSI-5005 OPTO Optical Assembly Work Cell
The MRSI-5005 OPTO offers 5 micron eutectic capability for laser submounts. Extremely precise placements are achieved with a thermally and mechanically stable platform offering fast settling times and +/- 5 microns (0.0002 inch) or better placement accuracy required for photonic applications. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping and controlled contact force for placing small delicate InP and GaAs die with "no touch" surface and edge features and small thin preforms. The equipment combines high speed and 5 micron accuracy from MRSI, an established supplier for the optoelectronics market.
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ADVANTAGES:
Accuracy
5 micron accuracy with repeatable precision for critical bonding applications. Reliable post bond accuracy for eutectic die attach.
High Cycle Rate
Fast linear motors, stable platform design, and optimized machine layout combine for high throughput.
Flexibility
Stand alone or in-line with SMEMA compatibility.
Advanced Software
Windows™ operating system for ease of programming and factory connectivity. XML database for off-line editing and network control integrated with full material traceability.
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360º Die Orientation
Die orientation over a full 360º is enhanced with boundary tracing and pattern matching. Filters are available for enhanced gain of edges for detection and for control over vision parameters.
Vision toolbox options include:
Mouse adjustable "region of interest"
User selectable colors for boundaries, fitted curves, matched patterns, and cross hairs
Boundary tracing choice of black to white or white to black and boundary tracing choice of in to out or out to in.
Eutectic Capability
Absolute thermal control for eutectic processing of temperature sensitive devices. Temperature profiles are programmable for an unlimited combination of multiple ramp up, dwell, and cooling steps. Pulsed heating and cooling provide control over process temperature. Process monitoring is displayed on a Windows™ screen.
Flip Chip Capability
Integrated vision utilizing an upward-facing camera, application specific lighting and optics for flip chip and thermal compression bonding.
Delicate Handling
Controlled contact force for placing delicate GaAs and InP devices.
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SPECIFICATIONS:
General
- Fast Ramp Heat Stage for Eutectic Bonding
- High Speed X-Y-Z-Theta Positioner
- Advanced Polymer Platform
- Automatic Material Handling
- Standalone or In-line (SMEMA)
- CE Certification
Mechanical
- Dual Linear DC Servo Motors
- Thermally Matched Materials
- Strategically placed Encoders
- Accuracy: +/- 5.0 microns, 3 sigma
- Repeatability: +/- 1.0 micron
- X-Y Resolution: 0.1 micron
- Theta Resolution: 0.003 degree
- Speed XY: 30 ips
Die Bonding
- 360º Random Die Orientation
- Programmable Force 10-2500g
- 3-4 sec. Cycle Rate Typical
- 13 Tip Automatic Tip Changing
- Waffle Pack, Gel-pak, or Wafer
Vision System
- Optical Alignment
- Global or Local Alignment
- Fiducials/Pattern Matching:
- User defined die or substrate edges, marks, patterns or other recognizable features
- Dual Magnification
- Lighting: Programmable Intensity per Pattern
- Oblique with ring or collimated with through the lens lighting
Facilities
- Power: 208 VAC, 60 Hz, 20 Amps
- Vacuum: 20" of Hg
- Pneumatics: 80 PSI, 5 cfm
- Dimensions: 32" (L) x 39.5" (W) x 64.4" (H)
- Weight: 3000 lbs (1360 kg), crated: 3500 lbs (1585 kg)
- CE Approved
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Eutectic Scrub
- Variable Amplitude
- Variable Frequency
- Programmable to scrub in any combination of positive or negative X or Y - for example scrub can include motion in + & - X then a + Y motion to slide die under a feed through pin
- Asymmetrical Scrub
- Programmable Force
Temperature Control
- Programmable Ramp Rates
- Programmable Dwell Times
- Profiles can include multiple ramp rates and dwells
- Ramp Rates greater than 40ºC/sec.
- Cooling Rates greater than 40ºC/sec.
- Real Time Process Temperature Monitoring
Packages
- Optical Modules
- Microwave Modules
- RF Modules
- Multi Chip Modules
- Hybrid Circuits
Material Handling Packages
- Auto Magazine Load & Unload
- Boat Conveyor or Lead Frame Indexer
- SMEMA Compatible, In-Line
- Mechanical/Vacuum Fixturing
- Heated Work Stage
- Common Carriers
- Sector Plates for Waffle or Gel-paks
Material Handling Components
- Laser Diodes
- Solder Preforms
- GaAs Die
- InP Die
- Submounts
- Monitoring Diodes
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