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Microwave Modules
Optical Modules
Hybrid Circuits
Multichip Modules
Semiconductor Packaging
Precision Height Sensing
Advanced Vision Alignment
Automatic Calibration
Automatic Needle Cleaning
Closed Loop Positive Displacement Heat
Stamping and Dispensing
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 Multichip
Assembly MRSI-605 Assembly Work Cell MRSI-M5 Underfill
Dispenser MRSI-175UF Integrated
Production Lines Encapsulation
Dispensing MRSI-175 ENCore Conductive
Epoxy Dispensing MRSI-175Ag Probe
Line
MRSI-175Ag Conductive Epoxy Dispenser
The MRSI-175 Ag is designed to provide unparalleled process control and dispensing capability demanded for applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. The 175 can meet stringent demands of these applications and deliver results. One example of these stringent demands is Microwave circuit manufacturing. In order to maximize thermal heat transfer, 100% coverage under the GaAs MMIC die is required while maintaining bondline thickness of one half of die thickness. The system's two heads can be configured with either two positive displacement dispense heads or one positive displacement dispense head and one stamp head - with the capability to repeatedly stamp dots as small as 0.005".
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ADVANTAGES:
Process Control
The 175Ag comes standard with a closed-loop positive displacement pump to ensure accurate dispensing of dots, lines and areas.
Height Sensing
MRSI offers various options for precision height sensing. Choose from tactile touch probe or non-contact laser height sensing. Multiple height mapping points can be specified to compensate for irregular and multiple heights.
Vision Alignment
Robust machine vision combined with collimated and ring illumination and quality optics and camera system.
Calibration
The system automatically calibrates the needle's tip position.
Cleaning
Automatic needle cleaning eliminates material build-up on the tip. This results in more accurate dispensing and less operator intervention.
Priming
Automatic needle priming assures precise dispensing.
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Dispense Needles
Choose from a broad range of application specific needles including tapered needles, polished needles and "footed" needles.
Material Handling
The 175 can operate standalone, in-line, cassette-to-cassette or batch mode.
Dual Real Time Video
The MRSI-175 Ag is available with dual real time video. The system automatically switches between dispense tips to focus on the tip currently being used.
Intuitive Graphical User Interface
The Ag's intuitive graphical user interface, running on Windows™, makes set-up and production a snap.
Turnkey Integrated Production Lines
The SMEMA compatible unit can be combined to create turnkey integrated lines. Combine with other manufacturers' SMEMA compatible units for a complete production line.
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SPECIFICATIONS:
X, Y, Z Dispense Stage
- Lead Screw Drive Mechanism
- Brushless AC Servo Motors
- Travel: 18" (X); 14" (Y); 2" (Z)
- Dispense Work Area: 12"(X);10" (Y)
- Programmable Speed: 0 - 20"/sec
- Resolution: 0.0001"
- Accuracy: ± 0.001" (X-Y) ± 0.0005" (Z)
- Repeatability: ± 0.0005" (X-Y) ± 0.0002" (Z)
Substrate Handling
- Input/Output Elevators: 1 In / 1 Out
- Magazine: Width: 2" to 4.3"
- Length: up to 12"
- Height: Typically 6"
- Up to 3 per elevator
- Transport Conveyors: 1
- Width: Adjustable to 1.0"-6.5"
- Height above floor: 37" ± 2"
- Lead Screw Drive Mechanism
- Stepper Motor
- Transfer Speed: 10"/sec.
- Substrate Detection: Optical (non-contact)
- SMEMA Interface Compatible
Dispense Pumps
- Conductive Epoxy Positive Displacement Pump: 20 Watts Servo Motor with Encoder Feedback Auger Drive Mechanism.
8 or 16 pitch screw; Complete carbide path for material flow; Carbide Screw; Carbide Insert; Microdispense Valve
- Stamping: This system utilizes a rotating epoxy well and adjustable doctor blade. Epoxy dots down to 0.005" are achievable.
Vision Capability
- Optical Alignment
- Global or Local Alignment
- Fiducials / Pattern Recognition: User defined die/substrate edges, marks, patterns, other recognizable features, ± 0.1 pixel
- Lighting: Oblique with ring or collimated with through the lens lighting
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Other Dispense Hardware
- Needle Tip Calibration: X, Y, Z Laser Scan
- Automatic Tip Clean
- Low Material Level Sensor: Capacitive
- Z-Height: Touch Probe: Accuracy: ± 0.0005"
- Laser: Accuracy: ± 0.0001"
Thermal Management
- Substrate Heat: Contact with vacuum port, 25ºC to 120ºC ± 2ºC
- Needle Tip Heat: 25ºC to 120ºC ± 2ºC
Software
- Windows™
- GUI Operator Interface
- CAD Downloading
- Component Library
- One step calibration of critical sub-systems
- Latest technology computer
Facilities
- Power: 208 VAC, 60 Hz, 20 Amps
- Vacuum: 20" of Hg
- Pneumatic: 80 psi, 1 cfm
- Dimensions: 35" (L); 39" (W); 58" (H)
- Weight: 1800 lb. (815 kg); crated 2200 lb. (1000 kg)
Safety
- Safety Interlocks: Drops power to motors in RUN mode
- Noise Level:< 75 dB
- CE Approved
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