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Encapsulation
High Volume Dispense
High-throughput encapsulation
Parallel processing conveyor lanes
Dual-LPD (dual chamber linear positive displacement pump)
Total process heating control
Intuitive graphical user interface - Windows™
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 Multichip
Assembly MRSI-605 Assembly Work Cell MRSI-M5 Underfill
Dispenser MRSI-175UF Integrated
Production Lines Encapsulation
Dispensing MRSI-175 ENCore Conductive
Epoxy Dispensing MRSI-175Ag Probe
Line
MRSI-175 ENCore Encapsulation System
The MRSI-175 ENCore Dual Lane Encapsulation System brings flexibility and performance to the most demanding encapsulation applications — delivers the highest flow rates, the best volumetric control and the lowest cost of ownership. It offers dual lane, parallel processing conveyors for continuous dispensing, can be configured with advanced thermal processing systems, and has a user-friendly yet powerful customized Windows® operating system. Its dual dispense heads (including a dual chamber linear positive displacement — LPD — pump), vision alignment, and enhanced features such as automatic needle calibration make the ENCore the world leader in encapsulation and BGA dam and fill.
 2000 Vision Award Winner
Patent Pending Dual Chamber Linear Positive Displacement Pump
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ADVANTAGES:
Continuous dispensing (no refill time between shots) for high throughput. True, precise and repeatable volumetric dispensing minimizes process errors
Interchangeable chamber sizes for application-specific needs for maximum flexibility
Parallel Processing Conveyors
Eliminates lost time due to substrate pre-heat and post-heat, and substrate load and unload, thereby increasing manufacturing efficiency
Thermal Management
Heated syringe chamber, heated dispense needle and heated substrate platform for pre
and post heating, result in enhanced process control
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Large Material Reservoir
Increased time between replenishment, minimizing calibration time and system
downtime - Up to 32 oz. cartridge handling capability
Modular Design
Multiple cells may be combined into an integrated process line to meet virtually any
throughput
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SPECIFICATIONS:
General
- Windows™ Operating System
- CE, SMEMA
- In-Line or Stand Alone
X, Y, Z Dispense Stage
- Lead Screw Drive Mechanism
- Brushless AC Servo Motors
- Travel: 18" (X); 14" (Y); 2" (Z)
- Programmable Speed 0 - 20"/sec.
- Resolution: +/- 0.0001"
- Accuracy: +/- 0.001" (X-Y); +/- 0.0005" (Z)
- Repeatability: +/- 0.0005" (X-Y); +/- 0.0002" (Z)
Substrate Handling
- Input/Output Elevators: 2 In/ 2 Out
- Magazine: Width: 2" to 4.3"
Length: to 12"
Height: Typically 6"
Up to 3 mags. per Elevator
- Transport Conveyors: 2
- Width: Adjustable to 4"
- Height Above Floor: 37" +/- 2"
- Transfer Speed: 10"/sec.
- Non-contact (optical) Substrate Detection
- Lead Screw Drive/Stepper Motor
Dispense Pumps
Rotary Pump (Dam)
- Auger Drive/DC Motor
- 8/16 Pitch, Stainless, Delrin, Carbide
- Flow rates 40-200 mgm/sec. (avg.)
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Dual Chamber Linear Pump (Fill)
- Positive Displacement
- Closed Loop DC Stepper Motor
- Displacement Length 1"
- Resolution: 0.2 microns/step
- Accuracy: +/- 0.001"
- Repeatability: +/- 0.0005"
- Volumetric Dispense Accuracy: >99%
- Flow Rates up to 3000 mgm/sec. (avg.)
Thermal Management
- Substrate Pre-heat: Contact w./Vacuum Port 25º C. to 120º C., +/- 2º C.
- Needle Tip Heat: 25º C. to 120º C., +/- 2º C.
- Post Heat (Optional): Heated N2 Blanket, 25º C. to 120º C., +/- 2º C.
Other Dispense Hardware
- Needle Tip Calibration: X, Y, Z Laser Scan
- Automatic Tip Clean
- Low Material Sensor
- Z-Height: Touch Probe: Accuracy: +/- 0.0005"
Laser: Accuracy: +/- 0.0001"
- Dispense Work Area: 12" (X); 10" (Y)
Vision Capability
- Optical Alignment
- Global/Local Alignment
- Fiducials/Pattern Recognition: User Defined
- Lighting: Oblique with ring or collimated with through the lens lighting
Dispense Packages
- Syringe: 5 - 10 - 30 - 55cc
- Cartridge: 6 - 20 - 32oz.
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