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Flip Chip
Underfill
High-throughput Flip Chip Underfill
Parallel Processing Conveyor Lanes
Linear Positive Displacement Pump
Total Process Thermal Control
Intuitive Graphical User Interface - Windows™
Advanced Vision System
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 Multichip
Assembly MRSI-605 Assembly Work Cell MRSI-M5 Underfill
Dispenser MRSI-175UF Integrated
Production Lines Encapsulation
Dispensing MRSI-175 ENCore Conductive
Epoxy Dispensing MRSI-175Ag Probe
Line
MRSI-175UF Underfill System
The MRSI-175UF is a high speed, high accuracy, automatic dispenser designed for flip chip underfill applications. With its dual lane capability and its new linear positive displacement pump, the MRSI-175UF offers high performance for the most demanding underfill applications at the lowest cost of ownership.
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ADVANTAGES:
Process Capability
High repeatability of dispensed volume is achieved with a closed loop positive displacement pump.
Dual lane Conveyor
Eliminates lost time due to substrate pre-heat and post-heat, and substrate load and unload, thereby increasing manufacturing efficiency.
Height Sensing
MRSI offers various options for precision height sensing. Choose from a tactile touch probe or non-contact laser height sensing. Multiple height mapping points can be specified to compensate for irregular and multiple heights.
Vision Alignment
Robust machine vision is achieved with collimated, ring illumination, quality optics, and a camera system.
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Calibration
Needle tip and platform locations are automatically calibrated.
Cleaning
Automatic needle cleaning eliminates material build-up on the tip. This results in more accurate dispense and less operator intervention.
Priming
Automatic needle priming assures precise dispensing.
Intuitive Graphical User Interface
The MRSI-175UF intuitive graphical user interface, running on Windows™, makes set-up and production a snap.
Cost of Ownership
The pump design simplifies maintenance and reduces cleaning time. Inexpensive disposable components are used to keep the overall cost of ownership lower than on any other system.
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SPECIFICATIONS:
General
- Windows™ Operating System
- CE, SMEMA
- In-Line or Stand Alone
X, Y, Z Dispense Stage
- Lead Screw Drive Mechanism
- Brushless AC Servo Motors
- Travel: 18" (X); 14" (Y); 2" (Z)
- Programmable Speed 0 - 20"/sec.
- Resolution: +/- 0.0001"
- Accuracy: +/- 0.001" (X-Y) 3 sigma; +/- 0.0005" (Z) 3 sigma
- Repeatability: +/- 0.0005" (X-Y); +/- 0.0002" (Z)
Dispense Pumps
Linear Pump
- Positive Displacement
- Closed Loop DC Stepper Motor
- Volumetric Dispense Repeatability: >99%, 3 sigma
Auger Pump- Brushless DC Servo Motor
- Removable Cartridge, Needle & Matl. Option
- Specialty Auger Screws
- Footed and Non-footed Needles
Thermal Management
- Substrate Pre-heat: Contact with Vacuum Port 25º C. to 120º C., +/- 2º C.
- Needle Tip Heat: 25º C. to 120º C., +/- 2º C.
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Substrate Handling
- Input/Output Elevators: 1 In / 1 Out (2 In / 2 Out option with 2 conveyors)
- Magazine: Width: 1" to 6.5"
Length: Up to 12"
Height: Typically 6"
Up to 3 stacked per Elevator
- Transport Conveyors: 1 (2 optional)
- Width: Adjustable to 1.0" - 6.5"
- Height Above Floor: 37" +/- 2"
- Stepper Motor driven Conveyor
- Conveyor Transfer Speed: 10"/sec.
- Substrate Detection: Optical (non-contact)
- SMEMA Interface Compatible
Other Dispense Hardware
- Needle Tip Calibration: X, Y, Z
Laser Scan
- Automatic Tip Cleaning
- Low Material Level Sensor: Capacitive
- Z-Height Accuracy w/Laser: +/- 0.0005"
Vision Capability
- Optical Alignment
- Global or Local Alignment
- Fiducials/Pattern Recognition:
User defined die/substrate edge, marks, patterns, other recognizable features - Lighting: Oblique with ring or collimated with through the lens lighting
Underfill Presentation
- Syringe: 5cc - 10cc - 30cc - 55cc
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