Using a combination of conductive epoxy stamping technology and specially designed placement tools MRSI is now able to assemble delicate beam lead diodes with the industry standard MRSI-505 Assembly Work Cell.
Conductive epoxy is deposited on to the substrate from a rotating well using extremely small stamping tools. Epoxy deposits down to 0.004 dots are repeatable produced using this method. Beam lead diodes are picked and placed using specially designed tools that support the foil like leads during the pick up and placement. This prevents the leads from deflecting upward when placed into the epoxy.
Extremely accurate control of the placement force along with precise control of the epoxy volume insures a robust process for these sensitive devices. The process is being used in production of a variety of customers including Alcatel, Thomson and GEC.
MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.
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