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Press Release - July 9, 1998
Contact:
Dan Crowley
Tel: (978)-667-9449
Fax: (978)-667-6109
E-mail:dcrowley@MRSIgroup.com
MRSI-375 Automated Work Cell Combines Precision with High Throughput, Flexibility for Microelectronics Assembly, Dispensing
The MRSI-375 Automated Work Cell offers
combined precision, high throughput, and process flexibility for
high-precision microelectronics dispense and assembly applications.
Truly modular in design, the MRSI-375 can be configured - and
individual units combined - to meet virtually any throughput or
assembly requirement, including the following:
-
Few Chip Modules
- Semiconductor Packaging
- Chip-on-Board, Chip-on-Flex, Flip Chip
- BGA Assembly
- Smart Cards
- Sensor Modules
- Saw Devices
The MRSI-375 can be configured with virtually any combination of
dispense and assembly heads--one dispense head and one pick and place
head, dual dispense heads or dual pick and place heads. The MRSI-375
can pick from JEDEC trays, wafer and waffle packs. The SMEMA
compatible units can be combined to create turnkey integrated lines.
Line balancing is easily achieved. The ability to reconfigure the
MRSI-375 reduces cost of ownership by minimizing future capital
investments, and spare parts, training and maintenance procedures are
common on all modules.
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