MRSI announces the availability of a new multi-tool head for automatic die bonding on the MRSI-375 Work Cell. This head allows the system to carry up to four or more collets simultaneously for higher throughput rates. Applications benefiting from this innovative feature include eutectic die bonding where a variety of components must be handled, including carriers, solder preforms, and assorted die sizes. The ability to carry all necessary collets available on the head allows for parallel processing, resulting in increased cycle rates. The MRSI-375 is a flexible automated work cell, used for a wide variety of dispense and assembly applications. The system is truly modular individual units can be combined to meet virtually any throughput requirement.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.