MRSI announces the introduction of wafer rotation for high aspect ratio die during automatic die bonding. This feature integrates the vision system with a mechanism for theta rotation of the wafer frame assembly in order to align the die with the fixed ejector pins. This process enhancement increases the number of die that can be used per wafer, resulting in higher yields. As the system picks die from the wafer tape, it first vision processes the die and then rotates the wafer to ensure that the individual chips and the row of ejector pins align. This feature is particularly important with long aspect ratio die, and particularly, for thin ones.

Increased demand for thin Gallium Arsenide and Silicon die in microwave and RF parts for communications and military applications has posed particular challenges for automatic die bonders. This advancement provides a solution to that challenge for direct picking from wafer.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor, microelectronics and electronic packaging industry.