MRSI has introduced a new hotplate system capable of ultra-fast temperature ramping for laser diode in-situ eutectic bonding on the MRSI-5005 OPTO. Temperature ramp rates this fast have never before been achievable for this application, making this a significant production enhancement.

Fast heat-up and cool-down is important for achieving high cycle rates in eutectic die bonding, and for minimizing the time that delicate parts spend at high temperatures. This is accomplished by using a hotplate with a high ratio of electrical power to thermal mass inertia. Fast cool down is accomplished by controlled pulsed inert gas flow around the heated element. MRSI has designed the hotplate of select materials for high thermal conductivity and has developed advanced controls for precise temperature control.

MRSI has incorporated advanced temperature profile monitoring for process development into the hotplate system. A thermocouple is available to be attached directly to the work piece, while the software displays the actual temperature in real time. This feature offers the advantages of direct feedback during process development, and of process monitoring during the assembly of product.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor, microelectronics and electronic packaging industry.