MRSI has announced it will be introducing 5 micron placement capability for optical applications used for data and telecommunications.

The system will be introduced at the SEMICON West trade show in San Jose, California on July 18-20, 2001 and will be configured for eutectic die attach of lasers and photodetectors onto submounts.

Extremely precise placement is achieved with a thermally and mechanically stable platform offering fast settling times and +/- 5 microns (0.0002 inch) or better placement accuracy required for photonic applications. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping and controlled contact force for placing small delicate InP and GaAs die with "no touch" surface and edge features, and small thin preforms.

In making the announcement, Daniel Crowley, Vice President Sales, stated "The optoelectronics market is looking for standard equipment with the combination of high speed and 5 micron accuracy from established suppliers. MRSI will provide that solution."

MRSI is a leading supplier of dispense and assembly systems for the semiconductor, microelectronics and electronic packaging industry.