North Billerica, MA - MRSI combines delicate GaAs handling and Flip Chip Bonding for microwave module production with the MRSI-505 HIGH FREQUENCY Assembly Work Cell. This technology boosts product quality and cuts production time by allowing for increased frequency and at the same time reducing required RF tuning.

For the process of thermal compression flip chip bonding, the MRSI-505 orients the die utilizing an upward-facing camera with integrated vision and application-specific lighting and optics. The die is then placed to a programmable controlled contact force. The system supports a broad range of forces and is able to be accurate over the entire range.

The MRSI-505, an advanced microelectronic assembly system, has become the recognized industry standard for ultra-precision assembly for microwave, RF and optical module manufacturing. It offers features that include high accuracy placement ±12 µm, 360¼ random die orientation, substrate alignment (global & local), programmable controlled force, delicate part handling including GaAs devices, automatic tip changing, cassette to cassette handling, waffle packs, gel packs, tape feeder, wafer pick up, and more.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry, and the leader epoxy die attach technology.