North Billerica, MA - MRSI has introduced its new MRSI-505 HIGH FREQUENCY Assembly Work Cell, a system specifically designed for the high frequency applications required for the communications, automotive and aerospace industries. The system can be configured for several component-attach technologies including eutectic bonding, epoxy die attach and flip chip bonding. Typical applications include transmitters, receivers, RF CATV, RF SOE, active radars, satellites, amplifiers, filters, sensors, and micro-electrical mechanical systems.

The system's design is based on the award-winning, industry standard MRSI-505. A solid granite platform supports the placement head from above so that no mechanisms are cantilevered. This feature makes the MRSI-505 HIGH FREQUENCY thermally and mechanically stable with extremely fast settling times and ultra accurate precision as required for RF and microwave applications. The system is configured for the particular eutectic bonding requirements of millimeter-wave, microwave and RF applications. It supports multiple eutectic processes, such as Gold Silicon, Gold Tin and Gold Germanium. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping. The system is available with in-situ eutectic bonding performed either on a hotplate, directly in a boat or in a chamber.

The MRSI-505 HIGH FREQUENCY automates tedious and critical tasks, a constant challenge for high frequency microelectronics. It routinely places delicate GaAs die with air bridges and vias with controlled programmable contact force. The system aligns and places randomly oriented die over a full 360 degrees, beam lead diodes (with foil leads) and parallel plate capacitors. Ultra-precision placement accuracy significantly reduces in-circuit tuning times.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.