North Billerica, MA - MRSI has solved the problem of presenting solder preforms for eutectic bonding by offering automatic preform feeding on the MRSI-505 PHOTONICS. This special preform feeder can handle reels of solder and cut a variety of preform sizes for immediate pick and place during the assembly process. Gold tin, gold germanium, and other materials are fed as ribbon to the feeder that utilizes a guillotine mechanism to cut the preform while it is held over a vacuum hole for positive location by the pick and place tool. The process is optimized by programming the cam driven blade and the stepper motor for control of indexing. By design, the feeder presents the preforms at the same height as normal tool movements to achieve high cycle rates. The introduction of this feeder eliminates the tedious task of manual cutting and transferring preforms to waffle packs.

The MRSI-505 PHOTONICS Optical Assembly Work Cell is specifically designed for optical applications required for telecommunications and data communications. The system can be configured for several component-attach technologies and applications including epoxy die attach, eutectic, and flip chip bonding. Typical applications include transmitters, receivers, switches, amplifiers, filters, photo detectors, laser submounts, and tunable devices.

MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.