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The system's design is based on the award-winning, industry standard MRSI-505 platform. A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered; this makes the MRSI-505 PHOTONICS thermally and mechanically stable with extremely fast settling times and +/- 0.0005 inch (12.5 microns) or better placement accuracy required for photonic applications.
The MRSI-505 PHOTONICS is configured for the particular eutectic bonding requirements of photonic applications, such as building submounts and photodetectors. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping. The system is available with in-situ eutectic bonding performed either in a hotplate, directly in a boat or in a chamber.
The MRSI-505 PHOTONICS handles tedious and critical tasks, a constant challenge for the optical industry, e.g., laser submount manufacturing. The MRSI-505 PHOTONICS routinely places small delicate InP and GaAs die with delicate surface features and picks and places small thin preforms.
In making the announcement, Daniel Crowley, Vice President Sales & Marketing, stated "The Optoelectronics market - driven by the Telecom revolution - is literally exploding. It's not just time-to-market that counts, but also time-to-volume production. Because the MRSI-505 PHOTONICS has the flexibility needed to handle both current and future products, short product cycles are no longer a problem, giving manufacturers the edge they need to meet their production goals, no matter how challenging."
The system's software automatically tracks key die and substrate information to keep a pedigree of each device. Plus the MRSI-505 PHOTONICS combines this tracing ability with its automatic barcode reading and program changing abilities.
MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.
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101 Billerica Avenue, Building 3 North Billerica, MA 01862-1256 Phone: 978.667.9449 Fax: 978.667.6109 | ||||||