MRSI, the world market leader in manufacturing advanced microelectronic assembly system, has announced the availability of the latest technology for eutectic die attach with the MRSI 505 Assembly Work Cell. This flexible system supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed loop temperature control, programmable up to 450 degree C., for eutectic bonding. For the process of direct Gold Silicon eutectic die attach, the MRSI-505 places the die with an inverted pyramid collet and simultaneously scrubs (variable amplitude and frequency) to accomplish eutectic reflow. A heated cover gas of H₂ N₂ mixture is blanketed over the hot plate.

For gold tin or gold germanium reflow, the MRSI 505 first places a preform onto the package. The die is then scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated gas cover of H₂ N₂ mixture is blanketed over the hot plate. The MRSI-505 is the industry leader for ultra precision die placement for epoxy die attach. MRSI is a leading supplier of dispense and assembly systems for the semiconductor and microelectronics industry.