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MRSI Breaks The 0.005" Dot Barrier Not long ago, MRSI set a new standard by being the first company in the world to achieve the ability to repeatedly dispense a 0.010" dot of conductive adhesive in a production environment. The MRSI-170 Precision Dispense System, the system that broke through the 0.010" dot "barrier", was introduced in the early 1990's to the industry and quickly became the standard for production dispensing of conductive epoxy for microwave, hybrid multi-chip modules and chip-on-board. Now, MRSI has introduced the MRSI-175 Ag Conductive Epoxy Dispenser. The system's two heads can be configured with one stamp head-with the capability to repeatedly stamp dots as small as 0.005". The 175 utilizes a micrometer-adjustable wiper blade and a rotating well to ensure that a consistent volume of epoxy is transferred to the stamping tool. The system's second head has a positive displacement pump which dispenses individual dots, lines and areas. Dan Crowley, VP Sales, commented that "the combination of stamping and syringe dispensing on the same platform has been enthusiastically received in the marketplace." 
Which is Better: Liquid Encapsulation, or Molding, for Fine Pitch BGA Packages? Many electronics manufacturers in the BGA encapsulation industry are currently examining and comparing the cost economies of transfer molding versus liquid encapsulation for wire bonded chips on organic substrates. In order to arrive at a conclusion, it's necessary to analyze all the issues relating to equipment, materials and the process. Once a thorough analysis is made, however, we believe that most will see that with regard to fine pitch BGAs, technical issues such as the elimination of wire sweep using liquid encapsulation avoid the effect of wire shorting and the resulting yield loss when using transfer molding. Although the cost of capital equipment (fixed cost) per unit throughput can be lower for molding than for dispensing, the cost of consumables including molds (variable cost) cannot be underestimated. This variable cost is much higher for molding (different BGA products require different molds) than for dispensing (nonexistent-no molds). Continuous technical developments in liquid encapsulant materials in recent years have enabled MRSI to engineer dispensers to address customer concerns, such as the ability to handle a broad range of material properties. This, plus the flexibility of having several pump options, has given MRSI the edge over competitors in BGA dam and fill dispense applications. The MRSI-175 Encore's architecture supports dual conveyors for parallel processing, dual dispense heads (one rotary and one dual chamber linear positive displacement pumps), vision alignment and enhanced GUI system software. Alcatel Space Industries of Toulouse, France, Joins Family Of Satisfied MRSI-505 Customers MRSI heads towards the next millennium with the 200th shipment of a fully automatic die attach system for microwave module production. An MRSI-505 system was supplied to Alcatel in Toulouse, France. This latest installation adds to MRSI's dominant position in microwave automated assembly. The industry standard MRSI-505 Ultra Precision Assembly work cell incorporates many microwave specific features. The long list includes special routines for duroid placement, eutectic reflow, precise force control for GaAs die handling, 360 degree die orientation, chip to chip alignment, alternate vendor capability, perimeter collets and complete material traceability. 
Shown L to R: Hakim Bentaieb (Alcatel), Mr. Philippe Bondeau (Alcatel), Jeroen Modderman (MRSI-Europe) and Michel Picard (Alcatel). MRSI's 175 Uf "Right Choice" For Capillary Underfill The MRSI-175family includes a variety of application specific configurations. The MRSI-175 Uf is configured specifically for the flip chip underfill market. Features include single or dual conveyors, single or dual dispense heads, rotary pump or dual chamber linear positive displacement pump. The capillary underfill system is built on the same industry standard MRSI-175 platform but with the underfills customer's specific requirements in mind. The dual head option gives MRSI the edge so that the customer can use one material (low CTE, high modulus) with one pump for underfill and another material (high CTE, low modulus) with another pump for fillet. This has shown to substantially minimize delamination, the most common cause for flip chip failures. Lots Of Interest For Live No-Flow Encapsulation Demonstration At Semicon West 1999 Visitors to the Dexter Electronic Materials (Industry, CA) booth were delighted to witness a live dual-function high-speed combined dispensing and assembly demonstration on the MRSI-375 at SEMICON West in San Jose, California recently. Potential customers expressed interest in the dual function of dispense and assembly on the MRSI 375, which was configured to dispense Dexter's single flux-underfill product (Hysol ¨ FluxFill™2000). In the demonstration, the dual process capability of the MRSI-375 gave the operator the ability to dispense the FluxFill™2000 onto to a substrate followed by flip chip placement. The assembled flip chips were then automatically transported to a reflow oven (Sikama) where solder reflow and underfill (FluxFill) cure were achieved simultaneously. This demonstration of leading-edge no-flow assembly technology, currently of high interest in the industry, was a hit. Following are some of the advantages of this flip chip assembly process over conventional capillary flow underfill:
15th Anniversary Celebrated With MRSI Group Fall Outing Fall was in the air - along with a few volleyballs, horseshoes, and golf balls - at the 15th annual MRSI fall outing recently. The event had all the essential ingredients for a good time - sporting events such as golf, volleyball, and horseshoes, plus music and good food, and of course the most important ingredient, the MRSI family. The ice cream bar was a bit hit! The outing was held at Kimball's Farm in Westford, Massachusetts. The outing celebrated 15 years of continuous growth and profitability for MRSI, which began as Micro Robotics Systems, Inc. in 1984. Patented Dual Chamber Linear Positive Displacement Pump Design Delivers Speed, Accuracy If speed and accuracy are your primary production requirements for dispense applications, it's time to consider MRSI's Dual Chamber Linear Positive Displacement Pump. Typical applications include BGA and CSP encapsulation fill (in conjunction with the dam), BGA cavity fill and capillary underfills. This pump is available with the MRSI-175 Encore in a single head dispense configuration or in a dual head dispense configuration with an additional rotary pump. Pump features include the following:
Customer benefits:
Automation Unlimited Brings "Sure Touch" To Automated Soldering Automation Unlimited has combined two essential elements of the automated soldering process-board touch sensing, and the soldering iron-into one, making the soldering iron tip the actual board touch sensor. This new "Sure Touch" technology simplifies the soldering process and guarantees contact between the soldering iron and the solder joint itself, for greater soldering consistency and fewer defects. There is no need for special programming to accommodate variations in height of individual solder points. "Sure Touch" ensures that all solder joints within an assembly will be soldered with consistent force control and precisely the right pressure regardless of the topography of the assembly, from one PCB to the next. On the Road to IMAPS 1999 MRSI will be displaying at IMAPS' 32nd International Symposium on Microelectronics, "Window to the 21st Century in Microelectronics", at the Chicago Hilton and Towers, October 26-28 1999, Chicago, booth # 1809. The show will bring together manufacturers and equipment suppliers for all aspects of microelectronic production. MRSI will display the following systems: MRSI-175 Ag, Precision Dispense System - This dual-headed system is the most accurate system available for precision dispensing of conductive adhesive for multi-chip modules, chip-on-board, hybrid and microwave modules. The system will be configured with one stamp head, stamping 0.005" dots - an industry first, and a second head with a positive displacement dispense syringe. MRSI-505, Ultra Precision Assembly Work Cell - The 505 is the industry standard for high precision assembly of multi-chip modules, hybrid, microwave modules. Interconnect technologies for these lines include chip and wire, eutectic and flip chip. The system configuration will incorporate eutectic attach capability. New Faces at MRSI In Support:
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