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New Linear Positive Displacement Pump Offered in Dual Conveyor ENCore MRSI's new Dual Piston Dispense Pump provides control to better than 1%, even when using the highest viscosity fluids. Positive displacement is achieved with a tightly toleranced piston and sleeve combination coupled with closed loop feedback from high-resolution linear encoders mounted on each piston. The pump's unique independently operated dual chamber design allows continuous dispensing. Built-in cartridge heaters with thermocouple feedback transfer heat to the pump sleeve. Parts are easily removed for cleaning and can be reinstalled without requiring any tools. A wide range of pistons, sleeves and valves are available to accommodate all types and volumes of fluids. The dual conveyor ENCore offers continuous processing for encapsulation applications such as Die Coat, Dam & Fill, Glob Top, Chip Underfill, Cavity Fill, and more. Its ergonomic design, sophisticated control and process monitoring system are real advantages for the user. A number of added features including on or off-line programming, self-diagnostic software, and a powerful, user-friendly Windows NT¨ environment put the ENCore at the leading edge of encapsulation technology. MRSI Leads In-Line Production of MCMs, Microwave Circuits, Hybrids MRSI continues to be the major supplier of integrated production line for manufacturing multi-chip modules, microwave modules, chip-on-board and hybrid circuits. Interconnect technologies for these lines include chip and wire, eutectic and flip chip. The advanced, adjustable-width material handling accommodates boards, boats, common carriers, and lead frames. The lines include automatic cassette loaders integrated with the MRSI-170 Precision Dispenser and the industry standard MRSI-505 Ultra Precision Assembly work cell. MRSI integrates standard industry belt furnaces and cassette offloaders. Any SMEMA-compatible module from other manufacturers can be integrated. Dan Crowley, MRSI's Vice President of Sales, emphasized that "The modular design and in-line material handling means the microelectronics industry can realize the same benefits normally associated with the higher volume surface mount and semiconductor industries." MRSI has the largest installed base of these systems, in the facilities of leading manufacturers worldwide. MRSI-375 Combines Precision, Throughput, Flexibility The new MRSI-375 Automated Work Cell offers combined precision, high throughput, and process flexibility for microelectronics dispense and assembly. The modular MRSI-375 can be configured - and individual units combined - to meet virtually any throughput or assembly requirement, including the following:
One can configure the system with virtually any combination of dispense and assembly heads—one dispense and one pick and place, dual dispense or dual pick and place. It can pick from waffle pack, wafer, and tape and reel. The SMEMA compatible units can be combined to create turnkey integrated lines. Line balancing is easily achieved. New Talents Fuel MRSI Growth and Expansion MRSI has hired new talent as part of the company's continuing growth and expansion, and its ongoing commitment to better serve its customers. Rita Pierce, Human Resources Manager. Rita has over 23 years of experience in human resources with such companies as IBM, DEC, Dow Jones, Gartner Group and Bruel & Kjaer Instruments. Jang Bok (JB) Park, MRSI's Customer Service representative in Korea. Prior to MRSI, JB worked for 18 years with Motorola-Korea in all facets of their semiconductor operation. Jeroen Modderman, Customer Service Representative located in the Netherlands. Jeroen reports into Hans Siedsma, Manager of MRSI Europe, and will be responsible for supporting MRSI's fast growing European installed base.
MRSI - 175 To Build Thermally Enhanced BGA Assemblies The Ball Grid Array (BGA) package has gained popularity for a lot of reasons. Reduced package size combined with low manufacturing costs give the BGA a bright future. However, power dissipation, in some devices exceeding 50 watts, can become a performance and reliability concern. New Thermally Enhanced BGA packages have the ability to transfer and dissipate heat generated in the IC. One of the most effective processes for building Thermally Enhanced BGAs incorporates a flip chip mounted IC on an organic substrate. A metal stiffener and heat spreader are then attached. The MRSI-175 combined assembly and dispense system provides the means to assemble the metal stiffener and heat spreader. The typical turnkey line is comprised of two to four MRSI-175 work cells (the number of cells depends on the number of required operations and the desired cycle rate). The MRSI–175 combines both assembly and dispense in one flexible module. The system's dual head architecture allows each module to be configured for multiple combinations of dispense and assembly. The SMEMA compatible modules may be interfaced together and/or with other process modules. Heat spreader and stiffener attach, cover placement, spacers, lids, tray sorting and virtually any mechanical assembly task are possible with the MRSI-175. Because the 175 was designed specifically for this purpose throughput and cost of ownership are optimized. The flexibility and dual head approach of the work cell allow the MRSI-175 to be configured for multiple tasks, minimizing expense and floor space. 
MRSI-175 Work Cell in Operation Automation Unlimited Selected Worldwide Supplier by T.I. Automotive Automation Unlimited continues to gain market share in robotic point soldering through new customers and repeat orders. Recently, Automation Unlimited was selected to be the supplier for Texas Instruments’ Automotive Division facilities worldwide. In making the announcement, Automation Unlimited's National Sales Manager, John Romano, said that Products including our SolderMate benchtop system and our AS10000B platform offer dual shuttle, rotary table, and in-line versions which provide flexibility to meet most any challenge presented by Texas Instruments." Testimonials to AU's ongoing success will appear in upcoming issues of EP&P Magazine. John added that "Our fiscal year 1999, beginning October 1, promises to be an exciting growth year for AU." AU MicroFlame 2000 Generates Widespread Interest The AU MicroFlame 2000 provides a solution for high speed soldering of high mass devices, such as those commonly used in automotive and other industries. The MicroFlame's precision positioning platform provides the control required to meet the demanding needs of specific applications that were previously impractical with existing flame soldering technology. The new system, featuring five axis control and a Windows NT¨ interface, uses a tiny hydrogen flame to instantaneously create robust solder joints. Temperature and solder volume control provide a high level of flexibility. The clear benefits of these outstanding features, among others, have led to recent sales of this equipment to Delco.
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