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A Message to MRSI Customers from Neil Srivastava, President

Since MRSI's founding in 1983, we have focused on providing our customers with the highest quality services and solutions. On January 23, we announced an agreement to be acquired by Newport Corporation that will significantly enhance our ability to serve you, our valued customer.
We at MRSI have concentrated our efforts on developing a full line of high precision, automated die bonding and dispensing products, as well as developing close relations with our RF, microwave, telecom, and semiconductor packaging customers. Through our association with Newport, we gain years of experience and a portfolio of expertise in testing, measurement and assembly applications for the fiber optic component and semiconductor industries.
MRSI and Newport share the same vision for the future of automated packaging and assembly and its importance in the evolution of photonics component manufacturing. Combined, our products will provide more of the end-to-end automated assembly required to meet the demands of the emerging telecommunications market while continuing to serve MRSI's customers in other markets including RF, microwave, advanced packaging and semiconductor packaging.
This acquisition broadens our solutions technology and market reach, while we retain our strong commitment to personal service and close relations with our loyal customers and existing markets. Through this combination, you gain access to global customer service organizations, and you will benefit from technology that greatly expands our new product development programs.
Newport, based in Irvine, California, has built a stellar reputation for quality innovation over the past 30 years. The company is rapidly becoming the leading single-source supplier of test, measurement and automation solutions to the fiber optic communications and semiconductor equipment industries. We are excited to be associated with them and for the future opportunities this new relationship will provide all of us.
In closing, I would like to personally thank our loyal customers. It has been a pleasure to serve you, and we look forward to continuing to serve your needs in the years ahead.

MRSI-5005 OPTO Provides True 5 Micron Eutectic Die Bonding

The MRSI-5005 OPTO offers 5 micron eutectic die bonding capability for photonics applications including laser submounts and photo detectors. Extremely precise placements are achieved with a thermally and mechanically stable platform offering fast settling times and +/- 5 microns (0.0002 inch) accuracy. Unique capabilities include a heated assembly station with fast closed-loop temperature ramping and controlled contact force for placing small delicate InP and GaAs die with "no touch" surface and edge features and small thin preforms. The MRSI-5005 is equipped with a hotplate system capable of ultra-fast programmable temperature ramping for laser diode in-situ eutectic bonding. MRSI has incorporated advanced temperature profile monitoring for process development into the hotplate system. Daniel Crowley, Vice President Sales, stated "The optoelectronics market is looking for standard equipment with the combination of high speed and true 5 micron accuracy from established suppliers. MRSI provides that solution."

MRSI Continues to Expand in 2002

MRSI has entered 2002 in "expansion mode", in large part because MRSI's core business of microwave, advanced packaging and photonics applications continues to be strong. MRSI is proud to count among its most recent orders companies such as Genoa Corporation, National Semiconductor, Alenia Marconi Systems, Lockheed Martin, Goodrich Aerospace, Alcatel Italy, Viasystems and Boeing, to name a few. Additionally, MRSI is experiencing expansion across all departments in the company with the addition of talented new people. Here are just a few examples:

Jon Medernach has been appointed East Coast Sales Manager. Jon will provide sales support to customers east of the Mississippi River. Jon brings over 18 years of equipment sales experience ranging from hybrid microelectronics, semiconductor to surface mount. He comes to us from Panasonic Factory Automation where he worked with the Create Group concentrating in wire and die bonding equipment.

Nicholas Nee has been appointed Asia Pacific Sales Manager for MRSI Group. Based in Singapore, Mr. Nee will provide sales support in the Asia Pacific region along with MRSI's local agents. Nee brings eight years of experience in the assembly and dispense equipment for the electronic industry to his new position on the MRSI team. He has previously held positions as Sales Manager for DEK Asia Pacific Pte Ltd. and Siemens Advanced Engineering.

Industry "First" - Automatic Stamping Tool Changing - Announced by MRSI

An industry "first" - the ability of a dispense system to automatically switch between a range of available stamping tools - is now available for the MRSI-175Ag Conductive Epoxy Dispenser. MRSI announces the introduction of automatic stamping tool changing, an innovation that boosts yields and provides greater process flexibility in high component mix production environments. With this innovation, MRSI-175Ag users now have the advantage of performing high volume dispensing and precise dot stamping on the same system for parts with a high mix of components, because the system can change tools during processing to stamp a variety of dot sizes or a variety of epoxy types. Stamping tools are available for 4, 6, or 10 mil diameter dots or can be custom designed for specific requirements. The epoxy well is configured for multiple epoxies, which can be stamped with different tools to avoid contamination. The stamping head is interchangeable with the second pump on the system. Thus, the 175 Ag can be run with two pumps simultaneously or with one pump and one stamping head.

MRSI Wraps Up Busy Show Season

MRSI was particularly active exhibiting both in the U.S. and abroad. Overseas, MRSI participated in the ECOC'01 show in Holland, European Microwave Week in England, and Productronica in Germany. Nationally, the company made a strong showing at IMAPS 2001 in Baltimore, as well as FAE in Chicago.

The MRSI-5005 OPTO was introduced with much fanfare on the European scene at Productronica 2001; right from the start, it was apparent that the OPTO would be a big success for MRSI. For starters, the MRSI-5005 OPTO offers the 5-micron placement accuracy much sought by the optical industry.

The company is now looking forward to the big events of first quarter 2002. MRSI will exhibit at APEX 2002, in San Diego, California, from January 22 to 24, 2002; and also OFC 2002, in Anaheim, California, March 19 to 21, 2002. At APEX 2002, MRSI will exhibit the MRSI-375 Assembly and Dispense Work Cell. Our booth # is 2202. Be sure to stop by our booth and see MRSI's latest technology if you plan to attend the show!

Multi-tool Head Enhances High Troughput

"MRSI announces the availability of a new multi-tool head for automatic die bonding on the MRSI-375 Work Cell. This head allows the system to carry up to four or more collets simultaneously for higher throughput rates. Applications benefiting from this innovative feature include eutectic die bonding where a variety of components must be handled, including carriers, solder preforms, and assorted die sizes. The ability to carry all necessary collets available on the head allows for parallel processing, resulting in increased cycle rates. The MRSI-375 is a flexible automated work cell, used for a wide variety of dispense and assembly applications. The system is truly modular individual units can be combined to meet virtually any throughput requirement.

Changeable Cartridge Style Pump Delivers Greater Dispense Flexibility and Ease of Use

Greater flexibility and quick changeover through changeable pump cartridges is the latest productivity enhancement announced by MRSI.
Users of cartridge style pumps now have the flexibility of swapping out changeable cartridges in minutes in order to switch the pump from a high volume dispense application such as dam and fill, to a more precise application such as silver filled conductive epoxy. This pump system is designed with a modular 'cartridge' that includes the pump auger and chamber as well as the dispense needle. This cartridge can be removed from the pump and stored with the fluid while another cartridge is installed. Cartridge replacement is accomplished without tools, with the resulting benefit that nearly no time be spent on changeover. Benefits of this innovation include simplification since only one system is needed for a variety of applications. The same MRSI system can deliver superior results for both conductive epoxy and underfill dispensing with a simple cartridge change.