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| January, 2001 |
www.mrsigroup.com |
Vol. IV, No. 1 |
New MRSI Web Site Goes "Live"!
MRSI's new web site has gone "Live"! The new web
site, which is in effect a completely new design and
replacement for the old site, gives MRSI Group-including subsidiary Automation Unlimited-a new
virtual presence online. Offering dozens more pages
of applications information, product information, and
a "customers only" site with special features and
information access, the new site is sharp, up to date,
and designed to offer the maximum amount of features
and information to customers, friends, and prospects
alike.
"This new web presence has been months in planning
and creation" explains Daniel Crowley. "In many ways,
this comprehensive and exciting new site reflects not
only the company and its image, but its leadership
position in the industry. It's an accurate picture of
who we've become, a global player dedicated to
leading-edge dispense and assembly solutions, and
to customer service."
The new site offers everything from company history
and information to product profiles and services,
employment opportunities, news announcements and
newsletters, a site search engine, and much more.
"It will remain relevant and current, reflecting the
direction of the industry" Crowley added. "It will be
updated frequently, with such features as "Hot
Applications" clickable buttons that will bring the
visitor directly to information and solutions to current
industry issues such as eutectic bonding, optical modules,
microwave module assembly, GaAs, die attach,
RF, few chip, and a host of others."
Tour the site! Visit www.mrsigroup.com
MRSI Recognized for Outstanding Performance by Alcatel
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| (L. to R.) Daniel Crowley and Neil Srivastava of MRSI; Philippe Bondeau, Yannick Pelissier and Patrick Rodriguez of Alcatel.
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MRSI received an appreciation plaque from Alcatel
Space Industries, Toulouse, France. The plaque displays
the pictures of satellites and a microwave module
and reads: "Alcatel Space Industries recognizes and
appreciates the outstanding performances of the
MRSI-505 for epoxy dispensing and highly accurate
placement. This machine is now qualified on microwave
hybrid manufacturing for space applications. We really appreciate the good reliability of this
equipment and the excellent technical support from
MRSI staff." In making the announcement, Daniel
Crowley warmly thanked Alcatel for its testimony of
appreciation. "We want to emphasize that it has been
a pleasure to serve them" he added.
MRSI Implements Flow Manufacturing To Meet Increased Customer Demand
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| (L. to R.front row) Lue Pare, Tony Perez, John Dery. (L. to R.rear row) Gil Lane Arie Bregman
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MRSI is implementing demand flow manufacturing
technology to meet the increased customer demand for
its products. Demand flow manufacturing is well-suited
for the customer-configured systems requiring
the utmost in quality at high volumes. In this form of
manufacturing, the materials primarily converge at the
product assembly just-in-time or kanban. Well-trained
and flexible work teams then assemble the products.
This provides the ability to increase manufacturing
capacity while maintaining the highest quality and pride
of ownership. Mike Chalsen, Vice President stated
"MRSI's order to ship cycle fits flow manufacturing
like a glove and improvements will even further satisfy
customer needs."
The combination of demand flow manufacturing and
MRSI's new manufacturing facility is allowing
MRSI to meet the increased demand for its telecom
and datacom customers. Typical products include
dispense and assembly products for optical, microwave,
RF and multichip modules. In many cases MRSI
provides a complete solution of a turnkey integrated
production line, in addition to dedicated dispense
and assembly modules. Interconnect technologies
include epoxy, eutectic and flip chip die attach.
High Throughput In-Line Eutectic
Die Bonding
MRSI's in-line eutectic provides a solution for its
customers to achieve not only fast times to market
but fast times to high production volume. MRSI offers
in-line eutectic die bonding for increased cycle rates
with the MRSI-505E and MRSI-375E. By utilizing a
progressive hot plate system which indexes through
heat zones, eutectic die attach is performed on the
same boat or carrier that transports parts through the
line. Absolute temperature control is achieved by
indexing parts through pre-heat, assembly, and post-heat
zones. Temperature profiling of each heat zone
enables fast processing of high-mass parts. High
throughput is achieved by limiting ramp time in the
assembly zone. All temperature zones are under a
cover gas of nitrogen and hydrogen mix to prevent
oxidation of the heated parts.
Eutectic bonding is performed at temperatures up
to 450 ¡ C through scrubbing with programmable
amplitude, frequency, and direction. The system
supports both direct eutectic (gold silicon) and reflow
eutectic (gold tin, gold germanium, etc). Two, three,
and four sided custom inverted pyramid collets are
available. The ability to perform eutectic die bonding
in-line with other assembly equipment completes the
solution for high throughput assembly with eutectic
die bonding.
MRSI offers turnkey integration to provide the
MRSI-505E or MRSI-375E combined with other
inline systems for a complete assembly solution.
New E-Mails To Contact Us
You can now contact us via the following easy to
remember e-mail addresses:
For technical support: support@mrsigroup.com
For parts information: parts@mrsigroup.com
For training information: training@mrsigroup.com
As always, if you need product information, you can reach
MRSI sales department at sales@mrsigroup.com
or the European office at sales@mrsieurope.nl
MRSI Combines Microstamping, Pump Dispensing For Ultra Fine Conductive Epoxy Dots
MRSI has announced the introduction of combined
microstamping with traditional positive displacement
pump dispensing, for conductive epoxy dispensing
in applications with beam lead diodes such as microwave
modules.
Ever-decreasing component geometry has necessitated
the development of microstamping, which allows
for conductive epoxy deposits down to 0.005".
Additionally, the total volume of the deposit is greatly
reduced by microstamping due to a much smaller
cross-section. The combination of microstamping
with traditional pump dispensing offers the ability
to accommodate these small geometries, as well as
providing both speed and versatility.
In process, the microstamping tool is placed into
a rotating well of epoxy that is constantly leveled by
a micrometer adjustable "Doctor blade". Once the
epoxy is acquired, the system applies the material
to the desired location on the substrate by lightly
touching down with the compliant tip.
The system's two heads can be configured with
either two positive displacement dispense pumps
or with one dispense pump head and one stamp
head. The positive dispense pump can dispense
accurate individual dots, lines and areas at production
rates.
Integrated Product Line Team Brings It All Together!
MRSI's Integrated Product Line Team brings together
years of experience in building microelectronic
devices. Our engineers who comprise this dedicated
team come from diverse backgrounds in the industry,
and have extensive experience in material handling,
epoxy curing, and wire bonding, among other disciplines.
Together, with MRSI's established expertise
in epoxy dispense and ultra-precise assembly, this
team can quickly bring together a product line to
meet any demand.
Turnkey Integrated Product Lines are built by integrating
MRSI's process-critical dispense and assembly
systems with those of other OEMs. Because MRSI
systems are fully SMEMA compatible, our engineers
easily integrate our technology with any other systems
that are necessary to complete the line and make it
operate seamlessly. These field-proven lines support
multiple interconnect technologies, including epoxy
die bonding, eutectic attach and flip chip. Available
turnkey systems include the following equipment:
Material Handling-Magazine Loading and
Unloading Systems
Material Handling-Conveyors (boat, lead frames,
and fixtures)
Epoxy Screen Printing
Dual Head Epoxy Dispense for Multiple Epoxies
Ultra Precision Assembly
Material Traceability
Curing Ovens-Thermal, UV, etc...
Bar Code Part Identification
Automated Plasma Cleaners
Auto Wire Bonders
Inspection Stations
And more...
Eutectic Preform Feeder Offered On New MRSI 505E
MRSI has solved the problem of presenting solder
preforms for eutectic bonding, by offering automatic
preform feeding on the MRSI-505E. This preform
feeder can handle reels of solder and cut a variety of
preform sizes for immediate pick and place during
the assembly process. Gold tin, gold germanium, and
other materials are fed as ribbon to the feeder which
utilizes a guillotine mechanism to cut the preform
while it is held over a vacuum hole for positive
location by the pick and place tool. The process is
optimized by programming the cam-driven blade and
the stepper motor for control of indexing. By design,
the feeder presents the preforms at the same height
as normal tool movements to achieve high cycle rates.
The introduction of this feeder eliminates the tedious
task of manual cutting and transferring preforms to
waffle packs.
MRSI's Continued Growth and Expansion
MRSI has successfully completed its move to a new
facility, which opened in mid-2000. It is located
at 101 Billerica Avenue, Building 3, North Billerica,
Massachusetts, on a site conveniently located just
off of Route 495, 35 minutes north of Boston.
Need directions?
Visit http://www.mrsigroup.com/contact.htm
It has been a record-breaking year for MRSI Group
with unprecedented domestic and international sales.
The company looks forward to a new year of customer
satisfaction and growth.
To fuel its expansion, MRSI has added new talent
to its teams. MRSI would like to welcome each and
every one of the new employees. As a customer, you
may have already met some of them:
Diane Gobron, for Customer Service specializing
in spare parts; Gregory Robinson, in Customer Support;
or Peter Cronin, Sales Engineer.
In Europe, there are also a number of new people:
Mark England and Francis Murphy, both Support
Engineers and Peter Poetschki as Dispensing
Application Engineer. Henri Trevisan has been
appointed Area Manager for South Europe. In the
office, Annemarie Oor has joined Angelique Maessen
as Office Manager.
See Us At These Upcoming Shows!
| Feb. 27-Mar 1, EtroniX, Anaheim, CA |
Booth A4225 |
| Apr. 23-28, SEMICON Europa 2001 |
Booth A2.684 |
| Apr. 24-26, SMT Nuremberg, Germany |
Booth 3-615 |
| May 22-24, IEEE, Phoenix, AZ |
Booth 621 |
| July 18-20, Semicon West, San Francisco,CA |
Booth 11238 |
| Oct. 7-11, IMAPS, Baltimore, MD |
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Top of Page
SOLUTIONS is the periodic newsletter of MRSI and the companies of MRSI Group. For more information, or copies of this newsletter, contact the company at:
101 Billerica Avenue, Building 3 North Billerica, MA
Phone: 978.667.9449 Fax: 978.667.6109
E-mail: sales@mrsigroup.com
Internet Web Site: www.mrsigroup.com
©2000 MRSI Group
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